Design And Reuse

Industry’s First End-to-End eUSB2V2 Demo for Edge AI and AI PCs at CES

As laptops, AI PCs, and the latest imaging systems demand even higher performance and lower power, SoCs are challenged to ...
Design And Reuse

BOS Semiconductors @ AISFC 2025

BOS Semiconductors participated in AISFC 2025, Korea’s leading AI semiconductor conference, held on December 10 and hosted by ...
Design And Reuse

South Korea to consider setting up $3.1 bln foundry to grow local chip sector

SEOUL - South Korea is considering building a 4.5 trillion won ($3.06 billion) foundry to make essential chips, funded by state and private investment, part of efforts to gain an edge in a race to ...
Design And Reuse

Samsung’s 4nm Process Has Witnessed Yield Improvements In The 60-70% Range, Enabling It To Reportedly Win A $100 Million Order To Develop An Omni Processing Unit For A U.S. Firm

The struggles experienced by Samsung’s foundry business could be on their way out because the 4nm process, which was previously said to be a nightmare for the Korean giant, is slowly stabilizing, with ...
Design And Reuse

ISOLDE Project Demonstrates Advancements in European Open-Source RISC-V for Automotive, Space, and IoT

Over the past two years, ISOLDE has reached important milestones in advancing RISC-V-based high-performance computing, safety, and security. These achievements pave the way for Europe’s leadership in ...
Design And Reuse

Three PCIe Encryption Weaknesses Expose PCIe 5.0+ Systems to Faulty Data Handling

PCIe is a widely used high-speed standard to connect hardware peripherals and components, including graphics cards, sound cards, Wi-Fi and Ethernet adapters, and storage devices, inside computers and ...
Design And Reuse

Hardware security to bolster interconnect IPs for SoCs, chiplets

Hardware security vulnerabilities have greatly expanded the attack surface beyond traditional software exploits, making hardware security assurance crucial in modern system-on-chip (SoC) designs. Chip ...
Design And Reuse

Intel Foundry Collaborates with Partners to Drive an Open Chiplet Marketplace

By Chek-San Leong, Senior Director, Head of IP and Chiplet Ecosystem Alliance, Intel ...
Design And Reuse

UMC Inaugurates the Circular Economy & Recycling Innovation Center

United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”) today officially unveiled its Circular Economy & Recycling Innovation Center, an on-site waste recycling facility located within the ...
Design And Reuse

Synopsys to Showcase Future of Automotive Engineering at CES 2026

Visit Synopsys during CES 2026 at the Las Vegas Convention Center, West Hall, Booth #6701 to learn more about the company’s automotive engineering solutions. Follow Synopsys online for updates via our ...
Design And Reuse

Quintauris and SiFive Announce Partnership to Advance RISC-V Ecosystem Development

Through this partnership, Quintauris and SiFive will work together to ensure key SiFive IP can be efficiently leveraged within the Quintauris framework, providing the entire value chain with more ...
Design And Reuse

Siemens and GlobalFoundries collaborate to deploy AI-driven manufacturing to strengthen global semiconductor supply

Agreement focuses on critical infrastructure in semiconductor manufacturing as well as broader applications for artificial intelligence, robotics, and connectivity ...