Fab tools are being fine-tuned for TSV processes as demand ramps for everything from HBM to integrated RF, power, and MEMS in ...

Source Heterogeneous SoCs for AI: The PULP Platform Experience” was published by researchers at University of Bologna.

In 2024, hot topics included challenges involving chiplets and heterogeneous integration, AI, data management, MCUs, power semis, software-defined vehicles, sensors, adaptive test, yield tracking, ...

Deep UV microLED for maskless lithography; avalanching nanoparticles for optical computing; Probabilistic computing with stochastic spintronics.

Next-gen EUV laser R&D; $285M CHIPS Act award; U.S. microelectronics research centers; Synaptics-Google deal; maskless microLED DUV; Micron's $2B fab expansion; Tesla sales slump; USB-C mandate in ...