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Semiconductor Engineering
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Managing EMI in High-Density Integration
Controlling interference in today’s SoCs and advanced packaging requires a combination of innovative techniques, but new ...
Semiconductor Engineering
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New Materials Are in High Demand
Development methodologies combine old and new techniques, but getting any new material into high-volume manufacturing is a ...
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InRak Kim
The conventional flip chip ball grid array (FCBGA) package platform has wide industry usage and provides high electrical ...
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