Researchers at UCSD and Columbia University published “ChipBench: A Next-Step Benchmark for Evaluating LLM Performance in AI-Aided Chip Design.” Abstract “While Large Language Models (LLMs) show ...
Workflows and the addition of new capabilities are happening much faster than with previous technologies, and new grads may ...
Understanding connectivity issues and interactions are only part of the problem; ECOs can cause unexpected problems in other ...
Verifying an extensible processor is more than a one-step process, especially when software compatibility is important.
A cornerstone of effective STCO is the ability to conduct multi-domain analyses—for example, signal integrity, power ...
Synopsys’ Secure Storage Solution for OTP IP introduces a multi-layer security architecture that pairs antifuse OTP ...
A new technical paper titled “Towards Safe Autonomous Driving: A Real-Time Motion Planning Algorithm on Embedded Hardware” was published by researchers at TU Munich. Abstract “Ensuring the functional ...
A new technical paper titled “Pushing the Envelope of LLM Inference on AI-PC and Intel GPUs” was published by researcher at ...
Evolving challenges and strategies in AI/ML model deployment and hardware optimization have a big impact on NPU architectures ...
Impact Of The Film Transfer And Grain Size On The Cu-barrier Properties Of 2D WS2 Films (NUS et al.)
A new technical paper titled “Enhancing Cu-barrier properties of 2D-WS2 barriers: The role of grain size and surface passivation” was published by researchers at National University of Singapore, ...
AI/ML are driving a steep ramp in neural processing unit (NPU) design activity for everything from data centers to edge ...
Researchers from Politecnico di Milano, Peking University, and Hewlett Packard Labs developed a Closed-Loop In-Memory ...
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