A new technical paper titled “Recent Progress in Structural Integrity Evaluation of Microelectronic Packaging Using Scanning Acoustic Microscopy (SAM): A Review” was published by researchers at ...

Scanning Acoustic Microscopy (SAM) has become a critical non-destructive testing method for confirming high reliability in aerospace and defense applications by detecting hidden flaws and validating ...

Traditional ultrasonic imaging systems usually transmit broadband ultrasonic pulses through the full sample volume under study. By analyzing these pulses, researchers can measure sample thickness, ...

SAM uses high-frequency ultrasound to inspect and characterise internal features of materials, detecting cracks, voids, inclusions, and delaminations that could compromise performance. SAM is a ...

Abstract: The reliability of integrated circuit (IC) packages depends in many respects on their mechanical integrity. The effect of structural weaknesses caused by poor bonding, voids, microcracks or ...

Students and faculty will soon see the world in a new light on campus. The College has won a grant to purchase a scanning electron microscope (SEM) with energy dispersive spectroscopy (EDS) ...

Researchers at University of California Davis (UC Davis) have designed a new laser-scanning approach to microscopy that is expected to open doors to brain-imaging in mouse models with improved speed ...

Hybrid bonding—a significant advancement in chip packaging technology—is becoming vital in heterogeneous integration, which enables semiconductor companies to merge multiple chiplets with diverse ...