SiSiC (reaction bonded silicon carbide, also known as RBSIC) grinding buckets are engineered to handle severe mechanical wear, impact, and chemical exposure. Compared with metal, polymer-lined, or ...
As global industries accelerate toward cleaner, more efficient, and more precise thermal processing, radiant heating ...
The 300mm silicon carbide wafer targets higher production capacity for power electronics and advanced system integration.
Device level SiC wafers require a systematic process including single crystal growth, wire cutting, lapping or grinding, and chemical mechanical polishing. SiC wafers have important application value ...
TOKYO & DURHAM, N.C.--(BUSINESS WIRE)--Renesas Electronics Corporation (TSE:6723, “Renesas”), a premier supplier of advanced semiconductor solutions, and ...
Last year was a record year for the company. In FY2022, Aehr achieved $51 million in revenues, which is not only the highest ever recorded, but also three times higher than the prior fiscal year. With ...
REUTLINGEN, Germany — Suppliers worldwide are investing heavily in silicon carbide microchips to help automakers hit their ambitious electric vehicle targets, spending billions of dollars to secure a ...
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