IC packaging, typically an afterthought in the design of a new-generation SoC, is particularly troublesome for communications circuits and high-speed interface circuits. Everyone wants small size and ...
Bugatti’s Tourbillon reimagines hypercar design through advanced packaging, merging a new V16 layout, aerodynamics, and ...
OrbitIO interconnect designer capabilities deliver hierarchical multi-substrate-optimized design for SoCs and ASICs across IC package/SiP and systems SAN JOSE, Calif., May. 04, 2016 – Cadence Design ...
Huawei has filed patents for a next-generation Ascend AI chip with a bold quad-die packaging design, a move insiders say could challenge Nvidia's dominance as US sanctions push China to build ...
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