Figure 1. These examples show the application of die design guidelines. Figure 1 illustrates applications of these guidelines to several different profiles. Figure 2. This is an example of a partition ...

The continued unbundling of SoCs into multi-die packages is increasing the complexity of those designs and the amount of design data that needs to be managed, stored, sorted, and analyzed. Simulations ...

As chip designs become larger and more complex, especially for AI and high-performance computing workloads, it’s often not ...

Like any successful system-on-chip (SoC) effort, a multi-die system-in-package (SiP) project must start with a sound system design. But then what? Are the steps in the SiP design flow different from ...

The core of the VISI-Series 12 CAD/CAM package is a solid modeler that can focus on manufacturing jobs with the addition of optional modules for machining, designing molds, and designing progressive ...

What makes up a multi-die/chiplet system? What’s driving demand for multi-die systems? The challenges of multi-die system design. Demands have never been higher for—and on—semiconductors. From smart ...

Editor?s note: Chris Rauwendaal is a designer, consultant, and seminar instructor who has written extensively on process engineering and extrusion topics. Part 1 of this article (PM&A Nov./Dec. 2002) ...

Guill Tool & Engineering has developed a reciprocal tubing die design. Unique features eliminate the need to weld or otherwise join sections with different profiles together. Traditional tip-and-die ...

VELIZY-VILLACOUBLAY, France--(BUSINESS WIRE)--Dassault Systèmes (Euronext Paris: FR0014003TT8, DSY.PA) today announced that it is working with the BMW Group to establish solutions to increase ...

The world is experiencing an insatiable and rapidly growing demand for artificial intelligence (AI) and high-performance computing (HPC) applications. Breakthroughs in machine learning, data analytics ...