What’s 3D IC, and what’s causing the shift from 2D IC to 3D IC? How does this new technology relate to heterogeneous integration and advanced packaging? What is required for a successful 3D IC ...

The Semiconductor Research Corporation just released its Microelectronics and Advanced Packaging Technologies (MAPT) Roadmap ...

Lam Research Corporation (NASDAQ:LRCX) is one of the best performing NASDAQ stocks according to hedge funds. On October 2, ...

2.5D and 3D Packaging Technology: The 2.5D and 3D packaging technologies encompass various packaging techniques. In 2.5D packaging, the choice of interposer material categorizes it into Si-based, ...

Ansys Redhawk-SC™ and Ansys Redhawk-SC Electrothermal™ have been certified by United Microelectronics Corporation (UMC) to simulate its latest 3D integrated circuit (3D-IC) packaging technology Chip ...

Powered by Money.com - Yahoo may earn commission from the links above. According to the SNS Insider,“The 3D Semiconductor Packaging Market size was valued at USD 9.78 Billion in 2024 and is projected ...

Advanced packaging technology continues to make waves this year after being a prominent highlight in 2023 and is closely tied to the fortunes of a new semiconductor industry star: chiplets. IDTechEx’s ...

3D packaging is rapidly transforming the semiconductor industry. 3D semiconductor packaging is a sophisticated packaging alternative for semiconductor chips that involve staking of atleast two or more ...

Mirtec, the South Korea–based manufacturer of optical inspection equipment, will showcase its latest semiconductor inspection system at Semicon West 2025 in Phoenix next month, as competition ...

High-performance computing, 6G communication, autonomous vehicle chips, and consumer electronics are all key markets that benefit from advancing semiconductor packaging. IDTechEx's report, "Advanced ...